Why does the FireGL X1 256MB use 16 BGA chips?
- Thread starter MuFu
- Start date
Does 256mbit high speed ddr exist? There is no reason it shouldn't exist, but for instance infineon has only 128mbit high-speed parts. Probably the quantities needed of 256mbit ddr drams is too small right now to make this economically feasible.
mczak
edit: just noticed hynix does in fact have up to 400Mhz, 8Mx32 ddr sdram chips. But still, did it exist when the card was introduced? Or, maybe ATI chose to use 16 ram chips because the card looks much more impressive that way
mczak
edit: just noticed hynix does in fact have up to 400Mhz, 8Mx32 ddr sdram chips. But still, did it exist when the card was introduced? Or, maybe ATI chose to use 16 ram chips because the card looks much more impressive that way
Must be, I guess. I notice Samsung have only had 3.3ns, 256Mb (32 x DQ) chips available for a short time. To be honest, I just assumed such memory had been available for a while. Not at the required rating, it would seem.
Have you got a link for that Hynix product?
MuFu.
Have you got a link for that Hynix product?
MuFu.
here's the link to the datasheet - looks like the part was introduced dec 02, rev. 0.2 ot the datasheet is from march 03: http://www.hynix.com/datasheet/eng/...&MS=256&ME=511&RAM_NAME=DDRSDRAM&SUB_RAM=256M
edit: now, that's interesting. According to the datasheet, these are not really 256mbit ram chips. They are multchip modules, packing 2 128mbit chips into one fbga chip!
edit: now, that's interesting. According to the datasheet, these are not really 256mbit ram chips. They are multchip modules, packing 2 128mbit chips into one fbga chip!
That's not too terribly wierd. 128MB NAND chips and Smart Media cards are composed of two die per chip.
When doing BGA packaging, there's an incremental increase in cost to do multi die in a chip, but its not heinously more expensive.
When doing BGA packaging, there's an incremental increase in cost to do multi die in a chip, but its not heinously more expensive.
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