With nV being so die space limited again, focusing heavily on the Tesla family in design, and trying to pack in as much compute power onto the die as possible under current fab, I'm guess the return of the NVIO is a safe assumption, no?
With that, what would the limitations be towards putting more than one traditional NVIO on the the PCB to allow for greater multiple monitor configurations (more as a rarer 'we can do it too' configuration than as a general design). With the DRAM and ROP/RBE partitions being an odd number as inferred from the blurry-diagram, I'm assuming a six-cluster would be easier to feed to two external NVIOs than 3 distinct groups of even numbers.
It would be another way to address a PR checkbox, in an era of the return of the checkbox (3DVision, Eyefinity, PhysX etc), and if possible would be simpler than an NVIO near-term redesign.
I'm just not sure of the restriction on the NVIO as there's not too much on the underlying design, just the base components included (TMDS, RAMDACs, etc).
I always thought the NVIO was a cop-out for near term, but would be essential if you wanted to go to an multi-die MCM style future design to avoid duplication of resources and maximize the transistor budget for this and the idea of multiple offspring designs (like Tesla).
I know there's 2 NVIO on the GTX295, but that's primarily due to the SLi considerations when communicating with the bridge.
Anywhoo, just curious if anyone knows for sure if dual NVIOs per chip was possible, or if it's limited by memory interface or RBE/ROP restrictions by design?