ATI's R350, RV350 taped out already?
Nvidia may have missed the boat
By Jansen Ng: Tuesday 10 December 2002, 16:08
THE INQUIRER has received several tips recently regarding ATI's R350 and RV350.
The first reiterates that ATI's R350 is being built on a 0.15 micron process. ATI's RV350 mainstream part is however being built on a 0.13 micron process.
What is new is that both the R350 and the RV350 have already taped out with their production partner TSMC, which did not do quite as good a job with their friend Nvidia.
The Nvidia NV30 super graphics VPU was planned to be launched using TSMC's 130nm copper and Chemical Vapor Deposition (CVD) low k dielectric process using Applied Materials' CVD low k Black Diamond product to wipe the floor with ATI. That would have been the first chip tape out for volume production using the most advanced foundry process currently available.
ATI has been more conservative in its process selection by relying on TSMC's proven 0.15 micron copper process without a low k dielectric.
Nvidia's GeForce FX using the NV30 chipis expected to be available to consumers in February, missing the Christmas boat. Many people have been snapping up Radeon 9700s and Radeon 9500s because they are widely available, and the best performing products to boot.
ATI's taping out means that those people who were waiting until February for NV30 might as well give up and buy Radeons now for little Timmy, or else wait a little bit into February and buy a Radeon 9900 Pro. µ
