Prophecy2k
Veteran
As the title says.
I guess this thread probably belongs in the semiconductor industry forum, but I wanted to focus the discussion on consoles, understanding that the development process for new console generations differs in very specific ways (in terms of the design considerations) from desktop PC parts.
Are we looking at 3D stacked ASICs becoming a viable path forwards for consoles? Or perhaps a new substrate, i.e. something other than silicon; e.g. graphene, Si Germanium etc..
Or are there ever more exoticsemiconductor process technologies and/or radical new computing paradigms that will bring the requisite performance improvements to keep computing performance advancements moving forwards in the mid to longterm?
I guess this thread probably belongs in the semiconductor industry forum, but I wanted to focus the discussion on consoles, understanding that the development process for new console generations differs in very specific ways (in terms of the design considerations) from desktop PC parts.
Are we looking at 3D stacked ASICs becoming a viable path forwards for consoles? Or perhaps a new substrate, i.e. something other than silicon; e.g. graphene, Si Germanium etc..
Or are there ever more exoticsemiconductor process technologies and/or radical new computing paradigms that will bring the requisite performance improvements to keep computing performance advancements moving forwards in the mid to longterm?