Sony PS6, Microsoft neXt Series - 10th gen console speculation [2020]


I meant as in more X100 SSDs, i.e at least a 2nd unit run. But seems like they won't do that, maybe only bother for legacy with some clients on server side if they need some extra units.

In any case, Intel are still continuing Optane for server markets, and persistent memory + CXL aren't mutually exclusive. Micron will carry over what they learned from 3D Xpoint into their future memory technology developments.
 
You can do both. I also do work in-between this. But why be snarky and passive-aggressive instead of contributing something valuable to the discussion?

Because snarky responses hopefully make people reflect about the silly nature of what they are doing right now:)
 
[SONY PLAYSTATION 6]

>More or less continues traditional console design philosophy

>Comes with an Entry-level PSVR Gen 3 helmet for standard SKU

>Revised DualSense controller, now full VR-capable. Unique three-piece design, revamped haptics,
positional/motion/acceleration/proximity detection. Center piece usable as a room-scale calibration
and tracking module (extras can be purchased separately; wireless connection to mesh grid
network for expanded, scaled tracking)

>Significantly revamped OS for VR-native navigation, features, etc.

>Optional VR controls will also be available for users who prefer it​

[CPU]

>CORES: 8 (CPU block 1), 8 (CPU block 2)

>THREADS: 16 (CPU block 1), 8 (CPU block 2)

>CLOCK: 5.2 GHz (CPU block 1), 5.2 GHz (CPU block 2)

>L1$: 64 KB (per core, CPU B1), 32 KB (per core, CPU B2)

>L2$: 1 MB (per core, CPU B1), 1 MB (per CCX, CPU B2)

>L3$: 8 MB (all, CPU B1), 4 MB (CPU B2)

>L4$: 8 MB (shared, CPU B1 & B2)

>>NOTES: CPU B2 is repurposed integration of PlayStation Stream CPU. PlayStation Stream CPU is more advanced (i.e features) processor vs PlayStation Fold, still 8C/8T design, lower-clocked in PlayStation Stream. Design necessary as PS Stream provides native play of PS4 titles requiring 8C/8T setup with similar L2$ and L3$ implementation.

B2 cores based on lower-scale Zen-ARM variants; have certain reduced functionality (reduced FP and AVX 256) vs. B1 cores that are based on regular design. Cores B1 & B2 operate in HMP (Heterogeneous Multi-Processing) Mode.​

[GPU]

>ARCHITECTURE: RDNA

>GENERATION: 7

>PROCESS: N3P

>CONFIG: Chiplet

>SHADER ENGINES: 2

>SHADER ARRAYS (PER SE): 2

>COMPUTE UNITS: 40 (20 per Shader Engine, 10 per Shader Array)

>COMPUTE UNIT CONFIGURATION: Dual CU

>SHADER CORES (PER CU): 128

>SHADER CORES (TOTAL): 5120

>ROPs: 128

>TMUs: 8 (per CU), 320 (total)

>ALUs/SHADER UNITS: 5120

>STATE MODES (IF ANY): 2; FULL (40 CUs), HALF (20 CUs)

>CLOCK FREQUENCIES: 3901.396 MHz (FULL), 4659.96 MHz (HALF)

>IPC: 2

>IPS: 6724.427 million IPS (FULL), 9319.9236 million IPS (HALF)

>THEORETICAL FLOATING POINT OPERATIONS PER SECOND: 39.95 TF (FULL), 23.859 TF (HALF)

># PRIM UNITS: 4 (2 each SE, 1 each SA)

># PRIMs/CLOCK PER UNIT: 4

># TRI RAS/CLOCK PER UNIT: 2

>PRIMITIVES PER CLOCK: 16

>TRIANGLES PER CLOCK: 8

>GEOMETRY CULLING RATE: 62.422 billion (FULL), 37.279 billion (HALF)

>TRIANGLE RASTERIZATION RATE: 31.211 billion (FULL), 18.639 billion (HALF)

>PIXEL FILL RATE: 499.378 Gpixels/s (FULL), 298.237 Gpixels/s (HALF)

>TEXTURE FILL RATE: 1248.446 Gtexels/s (FULL), 745.5938 Gtexels/s (HALF)

>THREAD DEPLOYMENT RATE: 40,960 (FULL), 20,480 (HALF)

>CACHE CAPACITY:

>L0$: 16 KB per CU (640 KB total)

>L1$: 64 KB per dual-CU/WGP (1.28 MB total)

>L2$: 512 KB per Array (2 MB total)

>L3$: 16 MB

>TOTAL: 19.92 MB

>CACHE BANDWIDTH:

>L0$: 39.55 TB/s (FULL), 23.62 TB/s (HALF)

>L1$: 27.685 TB/s (FULL), 16.534 TB/s (HALF) (L0$ * .70)

>L2$: 16.611 TB/s (FULL), 9.92 TB/s (HALF) (L1$ * .60)

>L3$: 8.3 TB/s (FULL), 4.96 TB/s (HALF) (L1$ * .30)

>TOTAL: 88.829 TB/s (FULL), 55.034 TB/s (HALF)​

[TASK ACCELERATION ENGINE]

**Heavily modified CU for various hardware-based RT, ML, IU, AI tasks

**Each Shader Engine is paired with a Task Acceleration Engine

**TAEs can house either 1 or 2 Task Acceleration Arrays

**TAAs can be of any given size when it comes to TAUs; however ideal
balanced designs generally call for TAAs that are 50% the core unit
count of a design's Shader Array (i.e a design with 5 Dual CU Shader
Arrays (10 CUs) having 5 TAU TAAs).

**TAUs can be thought of as pseudo-FPGA cores; each unit has internal
fixed-function hardware as well as a modified frontend compared
to normal CUs. TAUs also can range from having the following:

>2,000 To 8,000 logic cells

>16 Kb (2 KB) to 128 Kb (16 KB) distributed RAM (LUT) (acts as L0$)

>64 Kb (8 KB) to 512 Kb (64 KB) BRAM (acts as L1$)

>Internal Command Sync & Program Interface Configuration core
(directed by application to program the FPGA logic into
desired program state, manage unit state)

>Compute Thread Controller core (this is what programmers
interface with in dispatching code for the configured units
in the TAA to execute)

>1 Mb (128 KB) to 4 Mb (512 KB) SRAM (L2$, shared with all units in TAA;
meant for processed data locality storage)

>Shared 8 MB XIP (Execute-in-Place) Resource State Preset-allocated
MRAM (holds the microcode in bit-addressable/byte-addressable
format for immediate configuration)*

* = Will be able to be updated with future firmware changes

* = Shared between both TAAs

* = Simply used to configure the FPGA logic & fixed-function
aggregate unit states to specific profile presets (RT, ML, AI,
or IU) by storing the relevant set-up and configure/compile data​

># TAEs: 2 (1 per SA)

># TASK ACCELERATION UNITS (TAU) PER TAE: 5

>LOGIC CELLS: 5000 (per TAU); 25,000 (per TAE), 50,000 (total)

>LUT RAM (L0$): 12 KB (per TAU), 48 KB (per TAE), 96 KB (total)

>BRAM (L1$): 48 KB (per TAU), 240 KB (per TAE), 480 KB (total)

>SRAM (L2$): 384 KB (per TAE), 768 KB (total)

>MRAM: 6 MB (total)

># CU: 1 (PER DUAL CU IN SA), 5 (PER SA), 10 (TOTAL)​

[AUDIO]

>ARCHITECTURE: Tempest Audio (Tempest Audio Engine Next (TAEN))

>GENERATION: 2

>DSPs: 2

>PROGRAMMABLE LOGIC: 1

>Modified single CU core

>3.9 GHz (fixed clock)

>8 KB L0$, 32 KB L1$, 128 KB L2$DFD

>No L3$

>~ 1 TF (998.75 GFLOPs)

>Can leverage up to 40 GB/s of system bandwidth​

[MEMORY]

>TYPE: HBM4E

>GENERATION: 1

>MODULE CAPACITY: 2 GB

>MODULE AMOUNT: 16x

>CONFIGURATION: 1X 16-HI

>I/O PIN BANDWIDTH: 6.2 Gbps (775 MB/s)

>I/O PIN COUNT: 128

>BUS WIDTH: 2048-bit

>MODULE BANDWIDTH: 99.2 GB/s

>TOTAL BANDWIDTH: 1587.2 GB/s (1.5872 TB/s)

>TOTAL CAPACITY: 32 GB​

...2nd half below...
 
...continued...

[I/O COMPRESSION/DECOMPRESSION/MEMORY CONTROLLER]


[SSD]

>FORM FACTOR: M.2

>INTERFACE: PCIe-CXL

>INTERFACE GENERATION: 6.0

>CONNECTION SLOT(S): 1x (x4)

>NAND TYPE: ZNAND

>NAND MODULE CAPACITY: 2 Tb (256 GB)

>NAND MODULE BANDWIDTH: 2 GB/s

>NAND MODULE LATENCY: 1.8 ms

>NAND MODULE CHANNELS: 4 (per module), 32 (total)

># NAND MODULES: 8x​

>DEVICE BANDWIDTH: 16 GB/s

>MAXIMUM SUPPORTED BANDWIDTH: 32 GB/s

>DRIVE CAPACITY: 2 TB (2048 GB)

>MAXIMUM SUPPORTED DRIVE CAPACITY: 16 TB (16384 GB)​

[FLASH MEMORY CONTROLLER]

>STORAGE CACHE: IFC-SRAM, 384 MB

>STATUS: Internal cache control, GPU L4$ (shared cache)

**Specific implementation of Infinity Cache level for PlayStation 6

**Can replicate an approach similar to NVRAM without need reworking
of underlying memory sub-systems outside of virtual dynamic partition
scaling of the cache pool.

**Decompressor can stream through 96 GB of storage data into 384 MB cache
pool (would require 250 data block-buffer write cycles per second to the cache);
GPU can then access as an L4$ type Infinity Cache via an IFC cache
controller fabric (shared with the decompression hardware).

**Decompression block & flash memory controller logic sorts management of
cache coherency routines.​

>INTERFACE SUPPORT: x4 (full) M.2 PCIe-CXL 6.0 NVMe, x2 (half) M.2 PCIe-CXL 6.0 NVMe (either/or)

>BANDWIDTH CAPACITY (CACHE): 4150 GB/s (4.15 TB/s)

>LATENCY THRESHOLD: Sub-100 ns​

[COMPRESSOR/DECOMPRESSOR/MANAGEMENT]

>DECOMPRESSION BANDWIDTH LIMIT (HARDWARE): 96 GB/s

>DECOMPRESSION RATIO: 6:1

>COMPRESSION BANDWIDTH LIMIT (HARDWARE): 96 GB/s

>COMPRESSION RATIO: 6:1

># ENGINES: 4

1: IFC-SRAM Data Management Engine (DME)

2: RAM Data Management Engine (DME)

3: Network Data Management Engine (DME)

**Management for data over wifi and ethernet ports

4: Overhead/General Management Core Engine

**Orchestrates communcations of the other three DMEs​

[PERIPHERAL SUPPORT]

>USB GENERATION SUPPORT: GEN 1, GEN 2, GEN 3, GEN 4

>USB-C SUPPORT: YES

># USB PORTS: 4

>FRONT: Custom USB Gen 4 Type-C 3x2 Alt-Mode data port (VR), 1x regular USB Gen 4 Type-C 2x2 port
(controllers, charging kits, etc.)

>BACK: 1x USB Gen 4 Type-A 2x2 port, 1x USB Gen 3 port​

>MICRO SD SUPPORT: YES

*Used for physical media delivery (128 GB/192 GB Game Cards). Managed by FMC & Decompressor.

*Game Card Bandwidth: 60 MB/s​

># MICRO SD SLOTS: 1 (FRONT, UHS-III, SDHC class)

>THUNDERBOLT SUPPORT: NO​

[WIFI/ETHERNET/BLUETOOTH]

[ETHERNET]

>IMPLEMENTATION: Single Port

>ETHERNET PHYSICAL LAYER: 25 Gbit

>NAME: 25GBASE

>STANDARD: 802.3bq-2016

>CONNECTOR: RJ45

>LINE CODE: 64b/66b

>TRANSCEIVER MODULE
: SFP28

>RECOMMENDED CABLE: 25GBASE-CR, 25GBASE-CR-S

>BANDWIDTH: 3.125 GB/s​

[WIFI]

>IMPLEMENTATION: Single Module

>NAME: Wifi 7

>STANDARD: 801.11acx

>ENCODE RATE: 8b/10b encoding

>MU-MIMO STREAMS: 5

>BANDWIDTH: 2925.427 Mbps per MIMO, 14.627 Gbps theoretical, 1.828 GB/s converted​

...3rd part below...
 
...continued...

[VR SUPPORT]


>1x Entry-Level PSVR Gen 3 headset included with PS6

>Headsets also compatible with PC as VR peripheral units

>Includes wired (USB Gen 4 3x2 split as 4x USB Gen 3-speed Type-C ports), proprietary
connection w/ safety mechanisms to secure connection line

>Included VR helmet supports "2K" (1080p) 120 Hz

>10th gen PSVR headsets come in 3 model variants:

>ENTRY: Supports up to 2K (1080p) 120 Hz, per eye. $129.99 MSRP (1x with every PS6)

>Bandwidth rate: 8 BPC/RGB/No Compression/No Timing (6.37 Gbit/s (796 MB/s) * 2 = 12.74 Gbit/s (1.5925 GB/s))
lower end, 8 BPC/RGB/No Compression/CVT Timing (7.27 Gbit/s (908.75 MB/s) * 2 = 14.54 Gbit/s (1.8175 GB/s))
higher end.

>W/ USB 4 Gen 3x2 128/132b Encoding: 13.138 Gbit/s (1.642 GB/s) lower end, 14.994 Gbit/s
(1.874 GB/s) higher end

>W/ WiFi 7E: 13.66 Gbit/s (1.707 GB/s)(lower end), 15.59 Gbit/s (1.94 GB/s)
(higher end)(96% utilization on wireless module only); 16.67 Gbit/s (2.08 GB/s)
(lower end), 19.49 Gbit/s (2.436 GB/s)(higher end)(75% utilization on standard WiFi 7E
transmission devices).

>Built for uncompressed 2K 120 Hz per eye

>Built-in speakers

>Built-in entry level microphone

>Internal battery; can charge through the USB port when in wired mode. Can
also charge wireless via wireless transmission unit's charging station feature
(sold separately).

>Comes with 9' USB Type-C cable for wired play, charging, and data transmission

>160 degree FOV

>Built-in 2x 320 MHz bandwidth MU-MIMO antenna streams​

>ENTHUSIAST: Supports up to native QHD (1440p) 90 Hz per eye. $199.99 MSRP

>Bandwidth rate: 10 BPC/RGB/No Compression/No Timing (9.95 Gbit/s (1.24 GB/s) * 2 = 19.9 Gbit/s (2.48 GB/s))
lower end, 10 BPC/RGB/No Compression/CVT-RB Timing (11.04 Gbit/s (1.38 GB/s( * 2 = 22.08 Gbit/s (2.76 GB/s))
higher end.

>With USB 4 Gen 3x2 128/132b Encoding: 20.52 Gbit/s (2.56 GB/s) lower end, 22.77 Gbit/s
(2.846 GB/s) higher end

>W/ WiFi 7E: 20.696 Gbit/s (2.587 GB/s)(lower end), 22.96 Gbit/s (2.87 GB/s)
(higher end)(96% utilization on wireless module only); 24.875 Gbit/s (3.109 GB/s)
(lower end), 27.6 Gbit/s (3.45 GB/s)(higher end)(75% utilization on standard WiFi 7E
transmission devices).

>Built-in speakers

>Built-in upgraded microphone

>Internal battery; charge through USB port in wired mode. Can
also charge wireless if used with wireless transmission unit via
proximity with unit charge station functionality (sold separately).

>3.5 hours on full charge for wireless play.

>Comes with 12' USB Type-C cable for wired play, charging, and data transmission

>160 degree FOV

>Built-in 2x 320 MHz bandwidth MU-MIMO antenna streams​

>PERFORMANCE: Supports up to native 4K 90 Hz per eye. $399.99 MSRP

>Bandwidth rate: 10 BPC/YCbCr 4:4:2/No Compression/No Timing (14.93 Gbit/s (1.866 GB/s) * 2 = 29.86 Gbit/s (3.73
GB/s)) lower end, 10 BPC/YCbCr 4:4:2/No Compression/CVT-RB(16.23 Gbit/s (2.028 GB/s( * 2 = 32.46 Gbit/s (4.05
GB/s)) higher end.

>W/ USB 4 Gen 3x2 128/132b Encoding: 30.79 Gbit/s (3.849 GB/s) lower end, 33.474 Gbit/s
(4.184 GB/s) higher end

>W/ WiFi 7E: 31.0544 Gbit/s (3.8818 GB/s)(lower end), 33.75 Gbit/s (4.21 GB/s)
(higher end)(96% utilization on wireless module only); 37.325 Gbit/s (4.66 GB/s)
(lower end), 40.575 Gbit/s (5.0718 GB/s)(higher end)(75% utilization on standard WiFi 7E
transmission devices)*

* = 4K 90 Hz native refresh rate not provided with standard
WiFi 7E transmission devices​

>Optional wireless module sold separately; plugs into system's USB 4 Gen 4 3x2 port.
Wifi 7-based, following specs:

>Five MU-MIMO antenna streams

>7 GHz band (7234 MHz)

>Compatible with 320 MHz channel width

>2925.427 Mbps per MIMO

>14.627 Gbps theoretical

>1.828 GB/s converted

>~ 1.75 GB/s effective (96% utilization)

>Can support Entry headsets (1x, ALL. 2x, DSC 3, ALL), Enthusiast (1x, 10 BPC/RGB/No Compression/No Timing,
lower end), Entry headset (3x, ALL @ 90 Hz, DSC 3), (1x Entry (10 BPC/RGB/DCS 3/CVT-RB) + 1x Enthusiast
(10 BPC/RGB/DCS 3/CVT-RB))

>Eight-core/Eight-thread high-end ZEN-ARM processor block (repurposed PS6 CPU B2)

>Modified/repurposed GPU CU core

>Built-in compression hardware with DSC 3.0x support

>512 MB LPDDR5 RAM

>1 GB NAND

>MSRP $129.99​

>Second version, performance-level wireless VR module, has specs of:

>Ten MU-MIMO antenna streams

>Simultaneous dual-band (7 GHz (7234 MHz) + 7 GHz (7234 MHz))

>Compatible with 320 MHz channel width

>2925.4275064 Mbps per MIMO

>29.254275064 Gbps theoretical

>3.656784383 GB/s converted

>~ 3.51 GB/s effective (96% utilization)

>Supports Entry headsets (1x, ALL. 4x, DSC 3, ALL), Enthusiast (3x, 10 BPC/RGB/DCS 3/CVT-RB,
higher end), Professional headset (2x @ 90 Hz/DSC 3/CVT-RB, higher end. 3x, 8 BPC/YCbCr/DSC 3/
CVT-RB, mid-low end; 4x, 8 BPC/YCbCr/DSC 3/No Timing, lower end)

>Eight-core/eight-thread ZEN-ARM processor block (repurposed CPU B2 of PS6)

>Modified/repurposed GPU CU core

>1 GB LPDDR5 RAM

>2 GB NAND

>MSRP $249.99​

[PRICING]

>PS6: $499.99

>PS6 WIRELESS VR SKU: $599 (includes PS6, Entry VR headset, and Wifi Client Basic)​

>PSVR GEN 3 PERFORMANCE HEADSET: $349

>PSVR GEN 3 ENTHUSIAST HEADSET: $199

>PSVR GEN 3 ENTRY HEADSET: $129

>PS.STREAM: $199

>PS.STREAM & PSVR GEN 3 ENTRY HEADSET SKU: $299​

>DUALSENSE 2 CONTROLLER: $69

>PSVR WIFI CLIENT BASIC: $129

>PSVR WIFI CLIENT ENHANCED: $249​

[RELEASE]

>November 2027 or March 2028​
 
It's fun to be enthusiastic and speculate but there's a limit! :runaway:
If you lived in Finland I'd be right now checking if we have padded rooms free at the moment at my ward, and tell our doc to write M1 referral for you :yep2:
 
It's fun to be enthusiastic and speculate but there's a limit! :runaway:
If you lived in Finland I'd be right now checking if we have padded rooms free at the moment at my ward, and tell our doc to write M1 referral for you :yep2:

Lets look at it half full. With his enthusiasm he would make an amazing computer architect. He should probably think about taking a CS degree and designing computer hardware for games tbh.
 
This is a modern day example of this


It copies the outward appearance of released products, it has catchy marketing names for architectural features, sku names and pricing, etc etc. It looks like a press release from an actual about to launch console. But real products are not created by wishing up the eventual press release and expecting engineers to figure the rest out. Its the other way around.

You can build a bamboo controll tower and wear coconuts on your head like ear-phones, and that may look close enough for laymen, but still no airplanes will land there.
 
This is a modern day example of this


It copies the outward appearance of released products, it has catchy marketing names for architectural features, sku names and pricing, etc etc. It looks like a press release from an actual about to launch console. But real products are not created by wishing up the eventual press release and expecting engineers to figure the rest out. Its the other way around.

You can build a bamboo controll tower and wear coconuts on your head like ear-phones, and that may look close enough for laymen, but still no airplanes will land there.

Wow, it's almost as if we use what already exists, and has come before, to speculate & guess on what may come in the future. Must be a revelation!!

Quite disappointed with the discourse here to be perfectly honest; I never ask for nor expect consensus, but I didn't expect this level of snarky, passive-aggressive, dismissiveness. I had higher standards considering prior discussions, maybe my standards were too high :/

Think I'll just take a step back for a little while
 
Wow, it's almost as if we use what already exists, and has come before, to speculate & guess on what may come in the future. Must be a revelation!!

Quite disappointed with the discourse here to be perfectly honest; I never ask for nor expect consensus, but I didn't expect this level of snarky, passive-aggressive, dismissiveness. I had higher standards considering prior discussions, maybe my standards were too high :/

Think I'll just take a step back for a little while

Look, one can know the history of two football teams and make an educated guess at which one will win the match. One may even try to estimate the actual score, and go on a limb and guess, for fun, what player is gonna score which goal. But to go on and script out a play-by-play description of the entire match in detail, including even the chants the fans are gonna sing, is a bit over-blown, man. Nobody is even gonna read the whole thing. Its so ambitious its bound to be 90% wrong. Its not worth the time to read it, let alone write it...
 
Look, one can know the history of two football teams and make an educated guess at which one will win the match. One may even try to estimate the actual score, and go on a limb and guess, for fun, what player is gonna score which goal. But to go on and script out a play-by-play description of the entire match in detail, including even the chants the fans are gonna sing, is a bit over-blown, man. Nobody is even gonna read the whole thing. Its so ambitious its bound to be 90% wrong. Its not worth the time to read it, let alone write it...
This is a good analogy. @thicc_gaf don't take it the wrong way. I have enjoyed reading some of your posts but take this advice. I think you can make a good computer engineer.
 
This is a modern day example of this


It copies the outward appearance of released products, it has catchy marketing names for architectural features, sku names and pricing, etc etc. It looks like a press release from an actual about to launch console. But real products are not created by wishing up the eventual press release and expecting engineers to figure the rest out. Its the other way around.

You can build a bamboo controll tower and wear coconuts on your head like ear-phones, and that may look close enough for laymen, but still no airplanes will land there.

It has been tested out in reality more than once, I kid you not ;)
Cargo cult - Wikipedia
 
Wow, it's almost as if we use what already exists, and has come before, to speculate & guess on what may come in the future. Must be a revelation!!
I appreciated you jumping in with both feet, but it's plain too much! How much debate do you want over the Second version, performance-level wireless VR module's >2925.4275064 Mbps per MIMO? Pretty sure they won't be able to hit 2436.118653 Mbps myself...

No-one can really reply. I suggest you present a truncated summary to just what you think will be in the launch hardware with a view to what you want to discuss. CPU choice? Cache sizes? Secondary processors? A ream of detailed specs will just stand as a lengthy prediction, not a discussion point. ;)
 
>Future-proofed design with upclockable CPU

>Custom-built GPU card that is upgradable
Hey - my crystal ball clearly shows the death of dGPUs from all consumer HW.
There is no more need for modular HW, where you can replace components. It takes too much space, power, money, even expertise. This was great in the last century of geek users, not in the current where everybody plays games and uses computers.
Currently there is a need to put all of those components, including RAM, into a single chip. To save on all those costs. That's what all this new fancy packaging tech will give us. No chiplet GPUs, but a whole computer in a chip. Apple has enlightened me.
So i bet a beer we won't see a GPU card in future consoles. Two beer, actually. But ability to replace the single chip might be nice.

I came here to see if any midgen rumors include RDNA3?
Personally i doubt both a midgen refresh and a change of architecture.
 
I guess resurrecting threads from the grave is in the spirit of the season at least
This thread is supposed to be active up until the next-gen launches. I wonder if there's much merit in these talks any more? Next gen? PC in a console box. ¯\_(ツ)_/¯
Every single novel concept that could have made into this gen like Sony's various patents, eg. photon mapping hardware, came to nought. How excited can we get over little decompression hardware blocks or CU's reserved for some workload?
 
This thread is supposed to be active up until the next-gen launches. I wonder if there's much merit in these talks any more? Next gen? PC in a console box. ¯\_(ツ)_/¯
Every single novel concept that could have made into this gen like Sony's various patents, eg. photon mapping hardware, came to nought. How excited can we get over little decompression hardware blocks or CU's reserved for some workload?

RAMdisk :p

Hey - my crystal ball clearly shows the death of dGPUs from all consumer HW.
There is no more need for modular HW, where you can replace components. It takes too much space, power, money, even expertise. This was great in the last century of geek users, not in the current where everybody plays games and uses computers.

My crystal ball doesnt show the death of dGPU's for all consumer HW.
 
I dont know much about how technology can evolve, but the use of SSD to unload and load data fast made me think of this scenario:
What if speeds and access become so efficient that an SSD can fully emulate RAM and thus make RAM reduntant, or at least make the SSD fully complimemtary to RAM?
 
I dont know much about how technology can evolve, but the use of SSD to unload and load data fast made me think of this scenario:
What if speeds and access become so efficient that an SSD can fully emulate RAM and thus make RAM reduntant, or at least make the SSD fully complimemtary to RAM?

It's not even close currently. Latency is still orders of magnitude higher than RAM. Optane was a lot closer but was still much much higher latency. And Optane is no more, so I'm not sure if we'll see any companies attempt to go that direction again.

Regards,
SB
 
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