Computex 2007: RV630 at HIS, dual-chip and on AGP

Discussion in 'Beyond3D News' started by B3D News, Jun 5, 2007.

  1. B3D News

    B3D News Beyond3D News
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    We're not at Computex this year but our brethren over at HEXUS have made the trip, uncovering two RV630-based products by HIS that deviate from the norm. The first pairs two RV630s on a single die, the second bridges the chip to AGP, giving users of AGP one more reason not to bother upgrading to PCI Express.

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