Oh I agree that things are in a limbo until we receive official press documents, but the info I based this on is from the images that are posted by several websites (russian and german chip.de) so I assume these are extracts from the NDAed press info. Also did some reasoning on how they could implement this (the more I think of it the more possible pitfalls this AA technique has).
I am expecially worried about the screenshot above (Marketing should never release a screenshot like that, so I hope its a fake or an image created by members from the press - in which case its a GOOD image), it has quite a few artifacts and some might be caused by the FAA technique. I am looking forward to testing some special cases on their AA implementation though.
I have written up some text on how I think FAA might work, possibly will post it later. It seems to have interesting BW and storage advantages but a high risk of not AA-ing certain edges and lots of risk for possible additional artefacts in "special" situations.
At this point in time I am lost in their pixel shader structure (then again not much info to go by, I prefer looking at the pictures of slides rather than reading the text), but it currently makes no sense to me.
There is a block inside the chip diagram that suggests possible BW savings techniques, and the FAA system is in essence a BW saving technique.
K-