bgassassin
Regular
To add to what Tottentranz is saying about the case size change, when Iwata first showed the Revolution he said that they planned to make the case even smaller to about the thickness of 3 stacked DVD cases. Just because they showed the concept at E3 doesn't mean it will stay that way. If heat shows itself to be an issue, they will change it before mass production.
They would use NEC, not TSMC. NEC is a part of the 28nm alliance.
http://www.xbitlabs.com/news/other/...oin_IBM_in_28nm_Process_Tech_Development.html
I imagine that this is the sort of news that we have been waiting for. Does it sound like TSMC's new 28nm manufacturing process will be available to Nintendo considering an expected february availability:
http://www.dailytech.com/Nextgeneration+28nm+GPUs+Could+Be+45+Percent+Faster/article23158.htm
They would use NEC, not TSMC. NEC is a part of the 28nm alliance.
http://www.xbitlabs.com/news/other/...oin_IBM_in_28nm_Process_Tech_Development.html