Beyond3D Forum

Lazy8s · 20-Jan-2006, 04:18

DoCoMo revealed the 702i line of FOMA phones, some, and probably most, if not all, of which have 3D processors.

From left to right, it seems that the Sharp SH702iD is powered by OMAP2420, NEC's N702iD uses OMAP2420, the Fujitsu F702iD is driven by SH-Mobile3, Mitsubishi's D702i is using SH-Mobile3, and Panasonic's P702i utilizes OMAP2420.

archie4oz · 20-Jan-2006, 04:50

Most Japanese phones have been coming w/3D processors for a while now... (even EU phones have now (e.g. SE W900i) Sadly these FOMA handsets are rather uninspiring compared to the ones announced by Vodafone Japan and AU this week...

Lazy8s · 20-Jan-2006, 05:11

Yeah, phones with SH-Mobile3 have been out since 2004 and with OMAP2420 since last year.

For gaming, 702i Series screens and controls aren't well suited, but their processors can run OpenGL ES benches like Futuremark's robot on spire demo, Twilight, Cyber Samurai, and Proxycon at high, playable framerates.

Updated round-up:

Handheld/Embedded PowerVR
Intel 2700G (Marathon) -- MBX Lite + ARM XScale
Dell Axim X50v
Dell Axim X51v
PepperPad

Renesas SH7770 (SH-Navi I) -- MBX + VGP + FPU + SH-4
Mitsubishi Car Information Systems
Pioneer AVIC-ZH900MD
Alpine Car Information Systems

Renesas SH73182 (SH-Mobile3) -- MBX Lite + SH-4
DoCoMo FOMA Fujitsu F901iC
DoCoMo FOMA Mitsubishi D901i
DoCoMo FOMA Fujitsu F902i
DoCoMo FOMA Mitsubishi D902i
SK Teletech IM-8300
Motorola MS550

Renesas SH73230 (SH-MobileA) -- MBX Lite + SH-4

Renesas SH3707 -- MBX + VGP + FPU + SH-4
Sega Sammy Aurora

Texas Instruments OMAP2420 -- MBX + VGP + FPU + ARM11
DoCoMo FOMA NEC N902i
DoCoMo FOMA Panasonic P902i
DoCoMo FOMA Sharp SH902i
DoCoMo FOMA Sony Ericsson SO902i

Texas Instruments OMAP2430 -- MBX Lite + FPU + ARM11

Texas Instruments OMAPV2230 -- MBX Lite + FPU + ARM11

Freescale i.MX31 -- MBX Lite + FPU + ARM11

Philips Nexperia PNX4008 -- MBX Lite + ARM9
Sony Ericsson P990

Samsung S3C2460 -- MBX + ARM

Intel 2900G -- SGX + ARM XScale

roninja · 20-Jan-2006, 10:22

source? initially thought the 702i series would be just software updates of the 701i series so would be great if all the phones above did have 3D but will wait for official confirmation from IMG, or TI/Renesas this time.

Also what about the Pantech PN-8300?

Lazy8s · 20-Jan-2006, 16:52

Haven't seen official confirmation either, but most of these companies don't yet consider the processor as a selling point worth mention.

http://www.memn0ck.com/d/?FOMA/702i

I did make the big assumptions that OMAP referred to OMAP2 for the NEC and that SH-Mobile referred to SH-Mobile3 for Fujitsu's and Mitsubishi's.

I agree that Pantech's PN-8300 adopts the exterior design of their SK Teletech IM-8300, and I'd expect the new model to be pretty much the same phone, inside and out, that they used in Korea. Should get confirmation one way or the other soon enough.

roninja · 20-Jan-2006, 20:58

From the link it looks promising. Maybe TI will make a big splash at 3GSM....

Visit Texas Instruments
Hall 8

Stand B14/B15
3GSM 2006 in Barcelona.

Discover
how TI delivers technology
for 2G-2.5G, EDGE and 3G, as well as for mDTV & entertainment, security, connectivity, DRP™ and single-chip mobile phone solutions.

Experience the latest innovations in wireless technology, as well as the hottest new applications from TI's OMAP™ Developer Network.

See how TI solutions will pave the way for the transformation of the mobile phone into a work/life tool.

Click here for more information on TI's Wireless portfolio.

Gain valuable insight from Texas Instruments speakers at 3GSM:

Tuesday February 14th
11.20 - 11.50
Technology Symposium track

Hall 5, Level 3, Auditorium 1, Alain Mutricy, Vice President and General Manager of Cellular Systems will present "Delivering Multimedia through Handsets - Beneath the surface."
Thursday February 16th
14.30 - 15.00
Break Out Session C: Mobile Broadcast Standards - Status, Evolution & Competition

Hall 5, Level 3, Room 8 Bill Krenik, Advanced Wireless Architectures Manager will present "Behind the Standards - The Technical Issues & Impacts of these Developments"

15.00 - 16.00 Bill Krenik will participate in the panel discussion on "Integrating Mobile Broadcast with GPRS/3G"

Experience demos* showing how TI continues to enable handset manufacturers to innovate in a world driven by demand for on-the-go entertainment and productivity:

Live mobile TV on TI’s Hollywood™ solution and OMAP2420 processor
Windows Media Video and Audio on the OMAP2430 processor
S60 with MPEG4 and H.264 Video Playback on the OMAP2430 processor
Video Conferencing on the OMAP2430 processor
3G Voice Call on new OMAP-Vox™ solution
“Locosto” – TI’s Single-Chip Mobile Phone Technology: Application Suite with Java™ Services
"First Look" at New PCB for Ultra-Low-Cost GSM Phones
3D Gaming and Multimedia Suite on OMAP-Vox™ processor
Voice over WLAN using TI’s WiLink™ 4.0 mobile WLAN solution
Kodak's Perfect Touch™ technology on OMAP2420 processor
Philips DRM Technology using TI’s M-Shield™ security technology on OMAP2420 processor
And more...

See the latest TI technology in action in our Wireless Application Center, where you can play with the latest TI-enabled phones and applications on the market, including:

Kodak EASYSHARE-ONE Wi-Fi Enabled Camera

i-mateTM K-JAM All-In-One PDA

Nokia N91 HDD Music Phone

Samsung SCH-B250 Digital TV Phone

Motorola RAZR V3x Ultra-Slim Phone

i-mateTM SP5m Music Phone

Nokia 770 Internet Tablet

NTT DoCoMo FOMA P902i 3D Gaming Phone with output to TV

Texas Instruments and its OMAP™ Developer Network are creating compelling applications and services for mobile entertainment and productivity. Developer Network members who will be showing demos on the TI stand include:

February 13-14 February 15-16
PacketVideo
Ingenient
EA
Faith
Carrier IQ
Skype
Emuzed
Imagination
MSX Barking Lizards
McubeWorks
InterVideo
TAT
Esmertec
Ecrio
Philips Software
Access
Redbend

We look forward to seeing you at 3GSM in February!

Regards,
Texas Instruments

*Subject to change

SiBoy · 21-Jan-2006, 05:30

Quote:

Originally Posted by Lazy8s

I did make the big assumptions that OMAP referred to OMAP2 for the NEC and that SH-Mobile referred to SH-Mobile3 for Fujitsu's and Mitsubishi's.

Big assumption indeed!

Lazy8s · 24-Jan-2006, 15:41

The articles identifying the processors in the phones and claiming OMAP2420 were apparently incorrect. The 702i series might not be 3D equipped at all.

20-Jan-2006, 04:18	#1
Lazy8s Senior Member Join Date: Oct 2002 Posts: 2,833	702i Series DoCoMo Phones DoCoMo revealed the 702i line of FOMA phones, some, and probably most, if not all, of which have 3D processors. From left to right, it seems that the Sharp SH702iD is powered by OMAP2420, NEC's N702iD uses OMAP2420, the Fujitsu F702iD is driven by SH-Mobile3, Mitsubishi's D702i is using SH-Mobile3, and Panasonic's P702i utilizes OMAP2420.

20-Jan-2006, 04:50	#2
archie4oz ea_spouse is H4WT! Join Date: Feb 2002 Location: 53:4F:4E:59 Posts: 1,586	Most Japanese phones have been coming w/3D processors for a while now... (even EU phones have now (e.g. SE W900i) Sadly these FOMA handsets are rather uninspiring compared to the ones announced by Vodafone Japan and AU this week... __________________ "The sooner someone gets sued by Intel for violation, the sooner the patent can be revoked from orbit for gratuitous and wanton disregard for prior art and obviousness." ~TomF

20-Jan-2006, 05:11	#3
Lazy8s Senior Member Join Date: Oct 2002 Posts: 2,833	Yeah, phones with SH-Mobile3 have been out since 2004 and with OMAP2420 since last year. For gaming, 702i Series screens and controls aren't well suited, but their processors can run OpenGL ES benches like Futuremark's robot on spire demo, Twilight, Cyber Samurai, and Proxycon at high, playable framerates. Updated round-up: Handheld/Embedded PowerVR Intel 2700G (Marathon) -- MBX Lite + ARM XScale Dell Axim X50v Dell Axim X51v PepperPad Renesas SH7770 (SH-Navi I) -- MBX + VGP + FPU + SH-4 Mitsubishi Car Information Systems Pioneer AVIC-ZH900MD Alpine Car Information Systems Renesas SH73182 (SH-Mobile3) -- MBX Lite + SH-4 DoCoMo FOMA Fujitsu F901iC DoCoMo FOMA Mitsubishi D901i DoCoMo FOMA Fujitsu F902i DoCoMo FOMA Mitsubishi D902i SK Teletech IM-8300 Motorola MS550 Renesas SH73230 (SH-MobileA) -- MBX Lite + SH-4 Renesas SH3707 -- MBX + VGP + FPU + SH-4 Sega Sammy Aurora Texas Instruments OMAP2420 -- MBX + VGP + FPU + ARM11 DoCoMo FOMA NEC N902i DoCoMo FOMA Panasonic P902i DoCoMo FOMA Sharp SH902i DoCoMo FOMA Sony Ericsson SO902i Texas Instruments OMAP2430 -- MBX Lite + FPU + ARM11 Texas Instruments OMAPV2230 -- MBX Lite + FPU + ARM11 Freescale i.MX31 -- MBX Lite + FPU + ARM11 Philips Nexperia PNX4008 -- MBX Lite + ARM9 Sony Ericsson P990 Samsung S3C2460 -- MBX + ARM Intel 2900G -- SGX + ARM XScale Last edited by Lazy8s; 14-Feb-2006 at 10:10.

20-Jan-2006, 10:22	#4
roninja Member Join Date: Feb 2002 Posts: 254	source? initially thought the 702i series would be just software updates of the 701i series so would be great if all the phones above did have 3D but will wait for official confirmation from IMG, or TI/Renesas this time. Also what about the Pantech PN-8300? Last edited by roninja; 20-Jan-2006 at 13:22.

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20-Jan-2006, 16:52	#5
Lazy8s Senior Member Join Date: Oct 2002 Posts: 2,833	Haven't seen official confirmation either, but most of these companies don't yet consider the processor as a selling point worth mention. http://www.memn0ck.com/d/?FOMA/702i I did make the big assumptions that OMAP referred to OMAP2 for the NEC and that SH-Mobile referred to SH-Mobile3 for Fujitsu's and Mitsubishi's. I agree that Pantech's PN-8300 adopts the exterior design of their SK Teletech IM-8300, and I'd expect the new model to be pretty much the same phone, inside and out, that they used in Korea. Should get confirmation one way or the other soon enough.

20-Jan-2006, 20:58	#6
roninja Member Join Date: Feb 2002 Posts: 254	From the link it looks promising. Maybe TI will make a big splash at 3GSM.... Visit Texas Instruments Hall 8 Stand B14/B15 3GSM 2006 in Barcelona. Discover how TI delivers technology for 2G-2.5G, EDGE and 3G, as well as for mDTV & entertainment, security, connectivity, DRP™ and single-chip mobile phone solutions. Experience the latest innovations in wireless technology, as well as the hottest new applications from TI's OMAP™ Developer Network. See how TI solutions will pave the way for the transformation of the mobile phone into a work/life tool. Click here for more information on TI's Wireless portfolio. Gain valuable insight from Texas Instruments speakers at 3GSM: Tuesday February 14th 11.20 - 11.50 Technology Symposium track Hall 5, Level 3, Auditorium 1, Alain Mutricy, Vice President and General Manager of Cellular Systems will present "Delivering Multimedia through Handsets - Beneath the surface." Thursday February 16th 14.30 - 15.00 Break Out Session C: Mobile Broadcast Standards - Status, Evolution & Competition Hall 5, Level 3, Room 8 Bill Krenik, Advanced Wireless Architectures Manager will present "Behind the Standards - The Technical Issues & Impacts of these Developments" 15.00 - 16.00 Bill Krenik will participate in the panel discussion on "Integrating Mobile Broadcast with GPRS/3G" Experience demos* showing how TI continues to enable handset manufacturers to innovate in a world driven by demand for on-the-go entertainment and productivity: Live mobile TV on TI’s Hollywood™ solution and OMAP2420 processor Windows Media Video and Audio on the OMAP2430 processor S60 with MPEG4 and H.264 Video Playback on the OMAP2430 processor Video Conferencing on the OMAP2430 processor 3G Voice Call on new OMAP-Vox™ solution “Locosto” – TI’s Single-Chip Mobile Phone Technology: Application Suite with Java™ Services "First Look" at New PCB for Ultra-Low-Cost GSM Phones 3D Gaming and Multimedia Suite on OMAP-Vox™ processor Voice over WLAN using TI’s WiLink™ 4.0 mobile WLAN solution Kodak's Perfect Touch™ technology on OMAP2420 processor Philips DRM Technology using TI’s M-Shield™ security technology on OMAP2420 processor And more... See the latest TI technology in action in our Wireless Application Center, where you can play with the latest TI-enabled phones and applications on the market, including: Kodak EASYSHARE-ONE Wi-Fi Enabled Camera i-mateTM K-JAM All-In-One PDA Nokia N91 HDD Music Phone Samsung SCH-B250 Digital TV Phone Motorola RAZR V3x Ultra-Slim Phone i-mateTM SP5m Music Phone Nokia 770 Internet Tablet NTT DoCoMo FOMA P902i 3D Gaming Phone with output to TV Texas Instruments and its OMAP™ Developer Network are creating compelling applications and services for mobile entertainment and productivity. Developer Network members who will be showing demos on the TI stand include: February 13-14 February 15-16 PacketVideo Ingenient EA Faith Carrier IQ Skype Emuzed Imagination MSX Barking Lizards McubeWorks InterVideo TAT Esmertec Ecrio Philips Software Access Redbend We look forward to seeing you at 3GSM in February! Regards, Texas Instruments *Subject to change

24-Jan-2006, 15:41	#8
Lazy8s Senior Member Join Date: Oct 2002 Posts: 2,833	The articles identifying the processors in the phones and claiming OMAP2420 were apparently incorrect. The 702i series might not be 3D equipped at all.

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